LMMP 2000 v15 n1-6
grinding wheels having SiC in a vitrified matrix and diamond in a resin-bonded matrix (4). Rough grinding with a SiC wheel followed by fine grinding with a fine-grit diamond wheel was recommended, because SiC grains are harder than A1203 reinforcing particles and much less expensive than diamond grains. On the other hand, diamond turning
Get Price