Study on high efficient sapphire wafer processing by ...
2018-8-1 · The particle size of 10 wt.% diamond abrasive in polishing slurry was 3 μm. The slurry supplying rate was 1 mL/min. Moreover, the SG polishing of sapphire wafer was tested using a rotary-type polishing machine (UNIPOL-1200S, Kejing, China). The particle size of aluminum abrasives in SG polishing pad was 40 μm.
Get Price